Poor thermal management can lead to condensation and moisture accumulation on a PCB’s surface, triggering electrochemical migration (ECM) and other reliability failures.
Through real-world case studies, including a billion-dollar recall of a popular video game console due to ECM failures, this webinar will illustrate how improper heat dissipation can create failure-prone conditions, even in devices designed for controlled environments.
By examining design strategies that mitigate localized harsh conditions, this webinar will emphasize the importance of holistic thermal management and an effective cleaning strategy in safeguarding reliability.
Engineers and designers must not only consider external climatic factors but also ensure that the device itself does not become its own worst enemy.
Through real-world case studies, including a billion-dollar recall of a popular video game console due to ECM failures, this webinar will illustrate how improper heat dissipation can create failure-prone conditions, even in devices designed for controlled environments.
By examining design strategies that mitigate localized harsh conditions, this webinar will emphasize the importance of holistic thermal management and an effective cleaning strategy in safeguarding reliability.
Engineers and designers must not only consider external climatic factors but also ensure that the device itself does not become its own worst enemy.
You can view this webinar from your computer, tablet or mobile phone.
